In today’s world, technological innovations in fields such as semiconductors, flat-panel displays (FPDs), solar cells, smartphones, battery electric vehicles (BEVs), autonomous driving and generative AI are making remarkable strides. In particular, semiconductor devices are evolving towards greater miniaturisation and higher integration, with the minimum circuit width shrinking from 3 nanometres to 2 nanometres, whilst 3D packaging has enabled lower power consumption, higher speeds and smaller dimensions. Furthermore, FPDs are becoming increasingly larger in size, primarily due to the adoption of 10th-generation (2850mm × 3050mm) and larger technologies. Consequently, the functional requirements for bearings and linear motion products used in semiconductor and FPD manufacturing equipment—such as low dust generation, low outgassing, heat resistance, corrosion resistance and high rigidity—are increasing year on year. This is particularly true for the high-speed and high-precision performance demanded of mechatronic products that integrate these components.

By fully utilising technologies such as materials, lubrication, cleaning, surface modification and precision guidance, we have developed a product range suitable for use in vacuum, clean, high-temperature and corrosive environments. In this way, we contribute to the enhanced functionality and performance of various devices, whilst also contributing to environmental protection.